KUMTEK.electronic industries and trading co. ltd.

 


.contact.us

 

.türkçe.

 

home

products
assembly equipment

qfp/bga/csp rework
pcb cleaning

e
sd prevention
test equipment
optical inspection

bga reballing

 
partners
Mechatronika
Technoprint
Acculogic

DIT-MCO
Orbotech
Novastar
Winslow
Martin
K & K
APS


 


 



bga reballing

SOLDER BALLS AND
OTHER RELATED PRODUCTS

 


WINSLOW METHOD

SOLDER BALL PREFORMS

Once you remove the BGA, you can replace the balls and use the same BGA by using the Winslow method.

Regardless of the number of components you need to do, there's no easier method than reballing with the
SolderQuikTM BGA Preforms

These preforms are offered in 25 piece packages.

WHAT DO WE NEED?

1. Winslow profile
2. Proper sized frame
3. Flux
4. Reflow oven

 

       BGA Solder Ball Profiles

 

 

 

    Winslow Automation / Solderquik     Winslow Automation / Solderquik


LOOSE BALL METHOD

SOLDER BALLS
AND SOLDER BALL REPLACEMENT STENCILS / MASKS

Depending on the number and/or cost of the BGA, as well as your process capabilities, LOOSE BALL method is also another alternative. The unit cost will be significantly lower when you use the loose solder ball method.

WHAT DO WE NEED?

1. Proper sized frame
2. Proper stencil / mask
3. Proper diameter solder balls
3. Flux
4. Reflow oven

 

     




         
                 jel flux                       stencil /mask              solder balls

     
       mini reballing oven           various frames
                       
 


SAMPLE
SOLDER BALL REPLACEMENT STENCILS / MASKS

For some of the Intel chipset BGAs :

1. 31x31mm frame                               
2. Intel 82801GBM - FBM - DBM stencils / masks


 



        
       31x31mm frame                 82801 GBM FBM DBM stencils


REBALLING SET

For the motherboard repair places and some other electronics manufacturing companies, we suggest the Martin Reballing Set.

By the help of this set, users can reball different sizes of BGAs, with different pitch and ball diameters.

The set consists of the following :

A - MINI REBALLING OVEN

B - STENCIL / MASK AND FRAME SET

- 1 each 45mm main frame
- 2 each 1.27mm pitch metal stencil
- 2 each 1.00mm pitch metal stencil
- 7 each size conversion frames

    
 


    
        mini reballing oven   
    


   
     stencil and frame set

 


OTHER SUGGESTED PRODUCTS

- Jel Flux
 
100 gram, for leaded or lead-free process
   18 gram, for lead-free process


- Flux Pen
 
for leaded or lead-free process

- Solder Wick
  1.5mm x 30.5meter

- High Temp (Kapton) Tape

- Solder Balls
   leaded or lead-free, in various diameters

 


             
                 jel flux                    jel flux 18gr                 flux pen

               
                   solder wick                    high temp (kapton) tape 

        
                                solder balls