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bga reballing
SOLDER BALLS AND
OTHER RELATED PRODUCTS
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WINSLOW METHOD
SOLDER
BALL PREFORMS
Once you remove the BGA, you can replace the balls and use the same
BGA by using the Winslow method.
Regardless of the number of components you need to do, there's no
easier method than reballing with the
SolderQuikTM BGA
Preforms
These preforms are offered in 25 piece packages.
WHAT DO WE NEED?
1.
Winslow profile 2. Proper sized frame 3. Flux 4. Reflow
oven
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LOOSE BALL METHOD
SOLDER BALLS
AND SOLDER BALL REPLACEMENT STENCILS / MASKS
Depending
on the number and/or cost of the BGA, as well as your process
capabilities, LOOSE BALL method is also another alternative. The unit
cost will be significantly lower when you use the loose solder ball
method.
WHAT DO WE NEED?
1. Proper sized frame
2. Proper stencil / mask
3. Proper diameter solder balls
3. Flux
4. Reflow oven
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jel flux
stencil /mask
solder balls

mini reballing oven various
frames
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SAMPLE
SOLDER BALL REPLACEMENT
STENCILS / MASKS
For some of the Intel
chipset BGAs :
1.
31x31mm frame
2. Intel 82801GBM
- FBM - DBM stencils / masks
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31x31mm frame
82801 GBM FBM DBM stencils |
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REBALLING SET
For the
motherboard repair places and some other electronics manufacturing
companies, we suggest the Martin Reballing Set.
By the help of this set, users can reball different sizes of BGAs, with
different pitch and ball diameters.
The set consists of
the following :
A - MINI
REBALLING OVEN
B - STENCIL / MASK
AND FRAME SET
- 1
each 45mm main frame - 2 each 1.27mm pitch metal stencil - 2
each 1.00mm pitch metal stencil - 7 each size conversion frames
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mini reballing oven

stencil and frame set
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OTHER SUGGESTED PRODUCTS
- Jel Flux
100 gram, for leaded
or lead-free process
18 gram, for lead-free process
- Flux Pen
for leaded or
lead-free process
- Solder Wick
1.5mm x
30.5meter
- High Temp (Kapton)
Tape
- Solder Balls
leaded
or lead-free, in various diameters
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jel flux
jel flux 18gr
flux pen

solder wick
high temp (kapton) tape

solder balls
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